Controlled adhesion conductor

Details Controlled adhesion conductor Controlled adhesion conductor

1989-01-17

1993-01-05

Bell, Mark L.

Compositions

Electrically conductive or emissive compositions

Free metal containing

252518, 501 19, 501 20, H01B 102

Patent

active

051768534

ABSTRACT:
Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.

REFERENCES:
patent: 4517155 (1985-05-01), Prakash et al.
patent: 4728751 (1988-03-01), Canestaro et al.
patent: 4733081 (1988-03-01), Prabhu et al.
patent: 4816615 (1989-03-01), Prabhu et al.
patent: 4830878 (1989-05-01), Kaneko et al.
patent: 4940849 (1990-07-01), Morris et al.

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