Controlled adhesion conductor

Details Controlled adhesion conductor Controlled adhesion conductor

1990-07-13

1992-06-09

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

361411, 501 15, 501 18, 501 32, 427 96, H05K 706

Patent

active

051212986

ABSTRACT:
Compositions useful for printing controllable adhesion conductive patterns on a printed circuit board include finely divided copper powder, a screening agent and a binder. The binder is designed to provide controllable adhesion of the copper layer formed after sintering to the substrate so that the layer can lift off the substrate in response to thermal stress. Additionally, the binder serves to promote good cohesion between the copper particles to provide good mechanical strength to the copper layer so that it can tolerate lift off without fracture.

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