Controllable radiation curable photoiniferter prepared adhesives

Details Controllable radiation curable photoiniferter prepared adhesives Controllable radiation curable photoiniferter prepared adhesives

1992-10-29

1994-10-18

Berman, Susan W.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522 81, 522 83, 522 90, 522 96, 522100, 522103, 522149, 522166, 522173, 522174, 522904, C08F 250, C08F26506, C08F28500

Patent

active

053569474

ABSTRACT:
The present invention provides controllably curable photoiniferter containing adhesive compositions which are suitable for the mounting of microelectronic devices such as flip chips onto transparent wiring boards, a method of making the adhesive compositions, and a method of using the adhesive compositions in order to bond microelectronic devices to transparent wiring boards by intermittent exposure of the adhesive composition to a radiant energy source. The adhesive compositions can be cured in a stepwise fashion by intermittent controlled exposure to a source of radiation thus providing exactly the amount of cure and hardening desired.

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Hatada et al., Special Issue/Assembling Mounting Technology: Recent Trends in Wireless Bonding Technology, Semiconductor World, Sep. 1987.
Otsu et al., "Living Radical Polymerizations in Homogeneous Solution by Using Organic Sulfides as Photoiniferters", Polymer Bulletin, 7, 1982, pp. 45-50.
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