Control of substrate injection in lateral bipolar transistors

Metal working – Method of mechanical manufacture – Assembling or joining

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29576E, 29576W, 29577C, 29578, 148 15, 148175, 148187, 357 35, 357 44, 357 46, 357 89, 357 50, 357 91, 357 92, H01L 21265, H01L 2174

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045078483

ABSTRACT:
A method for fabricating a semiconductor structure which reduces substrate current injection from lateral bipolar transistors. A buried layer of a first conductivity type is formed in a semiconductor substrate of opposite conductivity. An epitaxial layer of the first conductivity type is formed such that at least a portion of the epitaxial layer overlies the buried layer. Isolation oxide regions are formed in a epitaxial layer. The isolation oxide regions extend to the substrate to define an island of electrically isolated epitaxial material. A selected impurity of the first conductivity type is introduced into that portion of the epitaxial layer beneath the to-be-formed lateral transistor. The lateral transistor is formed in the epitaxial layer.

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