Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1982-11-22
1985-04-02
Saba, William G.
Metal working
Method of mechanical manufacture
Assembling or joining
29576E, 29576W, 29577C, 29578, 148 15, 148175, 148187, 357 35, 357 44, 357 46, 357 89, 357 50, 357 91, 357 92, H01L 21265, H01L 2174
Patent
active
045078483
ABSTRACT:
A method for fabricating a semiconductor structure which reduces substrate current injection from lateral bipolar transistors. A buried layer of a first conductivity type is formed in a semiconductor substrate of opposite conductivity. An epitaxial layer of the first conductivity type is formed such that at least a portion of the epitaxial layer overlies the buried layer. Isolation oxide regions are formed in a epitaxial layer. The isolation oxide regions extend to the substrate to define an island of electrically isolated epitaxial material. A selected impurity of the first conductivity type is introduced into that portion of the epitaxial layer beneath the to-be-formed lateral transistor. The lateral transistor is formed in the epitaxial layer.
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Fairchild Camera & Instrument Corporation
Murray William H.
Olsen Kenneth
Saba William G.
Silverman Carl
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