Control of regeneration of ammoniacal copper etchant

Etching a substrate: processes – Nongaseous phase etching of substrate – Recycling – regenerating – or rejunevating etchant

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

1566421, C23F 146

Patent

active

055247806

ABSTRACT:
A method of improved control of recycle of ammoniacal copper etchant which uses metallic aluminum to remove copper without substantially adding undesirable byproducts. The very rapid reaction can be controlled by using a diluent of copper-free etchant, eliminating overheating. The separated copper and aluminum hydroxide sludge are easily filtered from the etchant. The purified etchant is now suitable for chemical adjustment and reuse.

REFERENCES:
patent: 3905827 (1975-09-01), Goffredo et al.
patent: 4058431 (1977-11-01), Haas
patent: 4082546 (1978-04-01), Wallace
patent: 4280887 (1981-07-01), Konstantouros
patent: 5472618 (1995-12-01), Bolser
Won, C. W. et al. Metall. Trans. B 24B(1) pp. 192-197.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Control of regeneration of ammoniacal copper etchant does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Control of regeneration of ammoniacal copper etchant, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Control of regeneration of ammoniacal copper etchant will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-348064

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.