Boots – shoes – and leggings
Patent
1991-10-09
1994-06-07
Black, Thomas G.
Boots, shoes, and leggings
364507, G06F 1572
Patent
active
053195701
ABSTRACT:
A method for the characterization of large scale wafer topography is applied to improving yields in the manufacture large scale integrated (LSI) devices. First, the heights at the center, the edge and an intermediate point are measured on eight equally spaced radii. This provides eight values each for Y.sub.s and Y.sub.e which are averaged. Then the shape angle .alpha. is computed using the following equation: ##EQU1## The shape magnitude M is also computed using the following equation: ##EQU2## The thus computed values of .alpha. and M are correlated with individual wafer characteristics as to device performance and yield. Based on these results, the wafer processing is controlled to provide optimal wafer yield and isolation characteristics.
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Automated Visual Inspection Techniques and Applications: A Bibliography, Roland Chin, Pattern Recognition vol. 15, No. 4, pp. 343-357, 1982.
Davidson Joanne M.
Hrebin, Jr. George
Lewis Robert K.
Orner Carl H.
Black Thomas G.
International Business Machines - Corporation
Wieland Susan
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