Control device consisting of at least two housing sections

Details Control device consisting of at least two housing sections Control device consisting of at least two housing sections

1999-01-25

2001-02-06

Picard, Leo P. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S707000, C361S719000, C361S737000, C257S706000, C257S707000, C165S080300, C165S185000, C174S016300, C174S050510

Reexamination Certificate

active

06185100

ABSTRACT:

The invention relates to a control device consisting of at least two housing sections in accordance with the species of the independent claims. With a control device known from DE-Gbm 92 006 24.8, a printed circuit board is fixedly inserted with the aid of screw connections between two housing sections, i.e. a housing cover and a housing bottom. The housing cover and the housing bottom are made of a material with good heat conductivity. In order to be able to dissipate the waste heat from the power components arranged on the printed circuit board via the housing elements, the printed circuit board is provided with a heat-conducting layer, for example a copper lining or a heat-conducting layer. However, the latest power components in particular generate such intensive waste heat that it is very difficult to dissipate it to the exterior with the aid of the conventional heat conducting layer and the customary structural layout. With other control device concepts, the entire underside of the substrate supporting the power components is provided with a heat-dissipation layer for dissipating the heat. Therefore this side of the printed circuit board can no longer be equipped with power components, which results in an increase in surface requirements and therefore an increase in cost.
BACKGROUND OF THE INVENTION
In contrast thereto, the control device in accordance with the invention has the advantage that there is a relatively low thermal transfer resistance between the printed circuit board and the support surfaces of the housing bottom being used as cooling element. It is possible in a simple and cost-effective manner to generate a contact pressure force of the printed circuit board on the cooling element by means of the mechanical aids. If required, a heat-conducting adhesive can also be applied between the support surface of the housing bottom and the underside of the printed circuit board, by means of which the thermal conductivity is once more optimized. The contact pressure force can be generated by simple structural effects, because of which the device can be produced at very favorable cost. A limitation to specific printed circuit boards is not necessary. Further, with the exception of the support area of the printed circuit board on the housing section, equipping with components on both sides is possible in a simple manner.
The novel features which are considered as characteristic for the present invention are set forth in particular in the appended claims. The invention itself, however, both as to its construction and its method of operation, together with additional objects and advantages thereof, will be best understood from the following description of specific embodiments when read in connection with the accompanying drawings.


REFERENCES:
patent: 5111362 (1992-05-01), Flamm et al.
patent: 5379188 (1995-01-01), Winslow
patent: 5402313 (1995-03-01), Casperson et al.
patent: 5590026 (1996-12-01), Warren et al.
patent: 5812375 (1998-09-01), Casperson
patent: 92 00 624 U (1993-07-01), None
patent: 000652694A1 (1993-11-01), None
patent: 19528632 A1 (1995-08-01), None

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