Contoured sputtering target

Details Contoured sputtering target Contoured sputtering target

1998-06-01

2000-07-11

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1434

Patent

active

060867353

ABSTRACT:
A contoured sputtering target includes a target member of sputtering material having a top surface, a bottom surface and an outer peripheral surface. One or more contoured annular regions are formed on the top surface of the target member that extend radially inwardly from the outer peripheral surface and away from the bottom surface. The target member may further include planar, concave or central recessed regions formed in the top surface that are surrounded by the one or more contoured annular regions. The configuration of the target member reduces generation of contaminating particles from nodules that may form near the outer peripheral surface of the target during a sputtering operation. Methods of forming a contoured sputtering target are also disclosed.

REFERENCES:
patent: 3630881 (1971-12-01), Lester et al.
patent: 3985635 (1976-10-01), Adam et al.
patent: 4551216 (1985-11-01), Argyo
patent: 5336386 (1994-08-01), Marx et al.
patent: 5538603 (1996-07-01), Guo
patent: 5658442 (1997-08-01), Van Gogh et al.
patent: 5753090 (1998-05-01), Obinata

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