Contoured quartz anode plate

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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Details

204192D, 204298, C23C 1500

Patent

active

041535286

ABSTRACT:
Sputter deposited coating uniformity is improved by contouring the anode plate to provide thinner regions around the wafer edges so that more resputtered coating material is deposited at the wafer edge to compensate for the observed decrease in coating thickness at the edge.

REFERENCES:
patent: 3661761 (1972-05-01), Koenig
H. M. Gartner et al., "Compensation Mechanism for Uniform Sputtering", IBM Tech. Disc. Bull., vol. 19, pp. 516-517 (1976).
S. S. Scianna, "Improving Uniformity of Sputtered Quartz", IBM Tech. Disc. Bull., vol. 13, p. 1448 (1970).

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