Continuous tab plater and method

Details Continuous tab plater and method Continuous tab plater and method

1978-07-13

1980-01-29

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204224R, C25D 502, C25D 1706, C25D 1728

Patent

active

041860624

ABSTRACT:
A tab plater for purposes of stripping tin lead from contact tabs, and replating the same for further preservation and improved electrical contact with metal such as nickel and gold is shown having a plurality of processing stations. The printed circuit boards are passed through various stations where plating or stripping is undertaken and masked by means of the transport system comprising opposed resilient belts and means for sealingly engaging the printed circuit board at a line of demarcation. The printed circuit boards are passed over positioning stations to transfer from one location to another to insure precise positioning of the line of demarcation. The sparger fluid flow at the plating station is controlled by means of a venturi effect created by reversely flowing the fluid over a flow control section immediately adjacent and beneath the line of demarcation whereby selective depth control can be maintained with lower pressures of fluid thereby avoiding excess leakage at the ends of the printed circuit board where a gap exists before the belts form an impervious fluid barrier.

REFERENCES:
patent: 3274092 (1966-09-01), Marantz
patent: 3723283 (1973-03-01), Johnson et al.
patent: 3933615 (1976-01-01), Levenson
patent: 4029555 (1977-06-01), Tezuka
patent: 4029564 (1977-06-01), Higuchi
patent: 4093520 (1978-06-01), Koontz

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