Continuous sputtering apparatus and method

Details Continuous sputtering apparatus and method Continuous sputtering apparatus and method

1979-09-24

1982-05-25

Gantz, Delbert E.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

204298, C23C 1500

Patent

active

043315267

ABSTRACT:
An R.F. Sputtering apparatus operable on a flexible continuous substrate. The substrate is suitable conditioned in a conditioning vessel, then passed through a sputtering vessel between spaced electrode pairs. Each pair consists of a target (cathode) and an anode. Each pair is independently energized from an r.f. source. Air locks are provided which enable substrate movement between and through the vessels without change of pressure and other physical conditions therewithin. Access doors or closures are provided over manholes which enable the targets to be serviced, replaced, etc.
Targets may be uppermost or lowermost; individual match boxes are provided for each electrode pair; heating and drive means may be provided in the main sputtering chamber; bias means may be provided for the anodes; support and/or tension controlling rollers may be provided in the sputtering chamber; and a vacuum cleaning system is provided to remove extraneous particles, dust, etc.

REFERENCES:
patent: 3205086 (1965-09-01), Brick et al.
patent: 3409529 (1968-11-01), Chopra et al.
patent: 3645545 (1972-02-01), Garnache et al.
patent: 3884787 (1975-05-01), Kuehnle
patent: 3945911 (1976-03-01), McKeluey
patent: 3968018 (1976-07-01), Lane et al.
patent: 4107350 (1978-08-01), Berg et al.
S. Hurwitt et al., "What is `In-Line` Sputtering?", Research/Development, Apr. 1975, pp. 43-44.

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