Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1986-06-09
1987-08-11
Godici, Nicholas P.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228260, 118316, B23K 306
Patent
active
046856056
ABSTRACT:
A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.
REFERENCES:
patent: 1277986 (1918-09-01), Merrill
patent: 3500536 (1970-03-01), Goldschmied
patent: 3825164 (1974-07-01), Sarnacki et al.
patent: 3866307 (1975-02-01), Pfahl, Jr. et al.
patent: 3899903 (1975-08-01), Lapierre
patent: 4115601 (1978-09-01), Ammann et al.
Finney James L.
Peck Douglas J.
Spigarelli Donald J.
Godici Nicholas P.
Heinrich Samuel M.
Smith Spencer T.
The HTC Corporation
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