Continuous solder reflow system

Heating – Advancing structure flexing – looping or coiling sheet – web...

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Details

432175, 432202, F27B 928

Patent

active

047923024

ABSTRACT:
An oven includes a plurality of pairs of upper and lower spaced non-focused infrared heater panels. Product is conveyed between these panels to effect solder reflow. To increase heat transfer and to achieve temperature uniformity, air is forced through equally spaced holes drilled in the insulating block of one or more upper heating panels. To define an equal flow through these holes, a valve is placed below the air intake opening to define an annular opening between the panel casing and the valve. The valve has openings having an area which is matched to the annular area between the casing and the valve.

REFERENCES:
patent: 3744963 (1973-07-01), Flynn
patent: 4116620 (1978-09-01), Stibbe
patent: 4217090 (1980-08-01), Whike et al.
patent: 4378207 (1983-03-01), Smith
patent: 4474552 (1984-10-01), Smith
patent: 4529379 (1985-07-01), DiCastri

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