Continuous process for the sequential coating of polyamide filam

Chemistry: electrical and wave energy – Processes and products

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8139, 427305, 427322, 427306, 204 21, 204 384, 204 40, C23C 1830

Patent

active

046455744

ABSTRACT:
A method of continuously sequentially coating polyamide filaments with copper and silver which utilizes as a key step in the process the use of a wetter solution containing alcohol, a detergent and an ethylene oxide and propylene oxide copolymer surfactant. The filaments are in the form of multi-filament tows, roving, woven tape or fabric and the steps involve immersing the filaments in a sodium hydroxide trisodium phosphate cleaning solution, followed by a water rinse and then immersion in the wetter solution, followed by water rinse and then followed by a conventional commercial pre-activator, then a commercial palladium chloride/stannous chloride catalytic activator, followed by commercial autocatalytic copper plating as a first copper plating step, followed by a subsequent copper plating step from a copper cyanide bath, followed by a conventional silver plating step, with appropriate water rinses after each of the plating steps, and finally with an alcohol rinse and drying.

REFERENCES:
patent: 3686019 (1972-08-01), Ohfuka
patent: 3801478 (1974-04-01), Heger
patent: 3967010 (1976-06-01), Maekawa
patent: 4002779 (1977-01-01), Nischwitz
patent: 4042737 (1977-08-01), Forsgren
patent: 4169171 (1979-09-01), Narcus
patent: 4340382 (1982-07-01), Morlino
patent: 4362779 (1982-12-01), Arsac

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