Continuous process for the manufacture of substrates for printed

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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Details

156176, 156178, 156324, 156439, 156441, 66 84A, 66 84R, H05K 302, H05K 346, B32B 3120

Patent

active

052698637

ABSTRACT:
A method for the manufacture in a continuous process of a flat substrate from a fibres-reinforced matrix for a printed circuit, in which use is made of at least two moving layers of reinforcing fibres and the fibres are positioned in at least two crossing directions, whereupon the filaments layers provided with matrix material, optionally together with one or more electrical conducting layers, such as a metal foil, and/or insulating layers on one or on either outer side, are passed through a preferably heated laminating zone, such as a double belt press, characterized in that use is made of filaments-containing layers made up of a plurality of mutually parallel filaments that are not bonded in the form of a fabric and extend substantially linearly.

REFERENCES:
patent: 3649411 (1965-04-01), Bolles
patent: 3756893 (1973-09-01), Smith
patent: 4460633 (1984-07-01), Kobayashi et al.
patent: 4547421 (1985-10-01), Dunbar
patent: 4556440 (1985-12-01), Krueger
patent: 4587161 (1986-05-01), Barrell et al.
patent: 4591659 (1986-05-01), Leibowitz
patent: 4609586 (1986-09-01), Jensen et al.
patent: 4659425 (1987-04-01), Eggers et al.
patent: 4670080 (1987-06-01), Schwarz et al.
patent: 4814945 (1989-03-01), Leibowitz
patent: 4877470 (1989-10-01), Krueger
patent: 4992123 (1991-02-01), Cave et al.
IBM Technical Disclosure Bulletin entitled "Low Dielectric Constant Material for Printed Circuit Boards," vol. 22, No. 5, Oct. 1979.

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