Continuous process for fabricating metallic patterns on a thin f

Details Continuous process for fabricating metallic patterns on a thin f Continuous process for fabricating metallic patterns on a thin f

1984-12-24

1985-12-24

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 20, 204 30, C25D 502, C25D 556

Patent

active

045604452

ABSTRACT:
A process is provided for fabricating metallic patterns such as resonant RF-tuned circuits on a polyolefin film such as polyethylene or polypropylene film. The film is processed under conditions such as to maintain its mechanical integrity by being passed through a solvent plasticizing bath, an etch bath to provide attraction sites and adhesion for catalytic metal deposition, a conditioning bath to improve catalyst adhesion and a catalyst bath to deposit a catalytic metal for electroless metal deposition. A negative image is printed on the film and an electroless metal deposit followed by an electrolytic metal plate are applied to the film to produce the desired metallic patterns. Optionally, prior to the printing step, an electroless metal deposit, with or without a thin electrolytic metal plate, can be applied to the total film surface. Thereafter, a negative or positive printed image is coated on the film. When these optional steps are utilized, the electroless metal deposit, thin electrolytic metal plate and printed image are selectively removed to leave the thick electrolytic metal plate on the electroless metal deposit in the form of the desired pattern.

REFERENCES:
patent: 3167490 (1965-01-01), Friedman
patent: 3208921 (1965-09-01), Hill
patent: 3956077 (1976-05-01), Hamby, Jr.
patent: 4082618 (1978-04-01), Furuya

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