Continuous heat treatment system of semiconductor wafers for eli

Details Continuous heat treatment system of semiconductor wafers for eli Continuous heat treatment system of semiconductor wafers for eli

1993-03-31

1995-09-12

Paschall, Mark H.

Electric heating

Heating devices

With power supply and voltage or current regulation or...

219485, 219486, 219388, 21912143, 204308, 432 44, 432 48, 432 53, H05B 102

Patent

active

054498830

ABSTRACT:
A heat treatment system is fabricated from a loading section, a heat treatment section and a outlet section integrated with one another, and the heat treatment section comprises a transfer mechanism provided between the loading section and the outlet section for successively transferring silicon wafers, a heating unit provided along the transfer mechanism for heating the silicon wafers, and a cooling unit provided along the transfer mechanism and closer to the outlet section than the heating section for cooling the silicon wafers so that the silicon wafers are continuously treated with heat for annihilating thermal donors produced from oxygen during the growth of a silicon crystal without any handling by operators.

REFERENCES:
patent: 4693777 (1987-09-01), Hazano et al.
patent: 4876437 (1989-10-01), Kondo
patent: 5003160 (1991-03-01), Matsuo et al.
patent: 5060354 (1991-10-01), Chizinsky
patent: 5200017 (1993-04-01), Kawasaki et al.

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