Continuous Flexible chemically-milled circuit assembly with mult

Details Continuous Flexible chemically-milled circuit assembly with mult Continuous Flexible chemically-milled circuit assembly with mult

1998-01-13

1999-11-02

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

29830, 29847, 216 20, B44C 122

Patent

active

059763914

ABSTRACT:
A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.

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