Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
Patent
1996-02-08
1998-05-26
Osele, Mark A.
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
156249, 1562728, 1563735, 359 12, 359 14, 359 35, B32B 3128
Patent
active
057559198
ABSTRACT:
A system which enables a film, e.g. a photosensitive material film, to be continuously laminated on and delaminated from a surface of a substrate, e.g. a hologram original plate, and allows duplication to be continuously effected. The system includes a film supply part (32) for supplying a film (1), a film laminating part (37) for continuously laminating the supplied film (1) on a film laminating substrate (35), a film delaminating part (37') for continuously delaminating the film from the substrate (35), and a film take-up part (43) for taking up the delaminated film. In the system, no air bubbles are trapped when the film (1) is laminated on the substrate (35), and no peel unevenness, e.g. undesired line, occurs when the film (1) is delaminated from the substrate (35). The system is suitable for use in a hologram duplicating apparatus, a dimple relief pattern duplicating apparatus, a microscopic test sample preparing apparatus, etc.
REFERENCES:
patent: 3306798 (1967-02-01), Gaenge
patent: 4263085 (1981-04-01), Ellis
patent: 4624875 (1986-11-01), Watanabe et al.
Nishikawa Shingo
Ueda Kenji
Dai Nippon Printing Co. Ltd.
Osele Mark A.
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