Continuous electroplating of conductive foams

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C25D 706

Patent

active

049784315

ABSTRACT:
The present invention resides in the discovery that a strip of reticulated foam which is semi-conductive can be continuously electroplated, utilizing a cathode roll which is positioned, in a first electroplating zone, outside of the electroplating bath. An anode is immersed in the electroplating bath. The strip of reticulated foam is first introduced into the electroplating bath and travels in the direction from the anode to the cathode roll prior to contacting the cathode roll. In this way, the strip achieves a partial plate at the anode which provides a current path between the anode and the cathode roll effective for sustaining the plating reaction in said first electroplating zone.

REFERENCES:
patent: 1243654 (1917-10-01), Clark
patent: 3549505 (1970-12-01), Hanusa
patent: 3694325 (1972-09-01), Katz et al.
patent: 4077853 (1978-03-01), Coll-Palagos
patent: 4251603 (1981-02-01), Matsumoto et al.
patent: 4326931 (1982-04-01), Kamijo et al.
patent: 4436601 (1984-03-01), Branchick et al.
patent: 4687553 (1987-08-01), Solomon et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Continuous electroplating of conductive foams does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Continuous electroplating of conductive foams, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Continuous electroplating of conductive foams will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1424232

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.