Continuous electroplating apparatus

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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204224R, C25D 1700

Patent

active

050451677

ABSTRACT:
Continuous spot plating, for example, of spots or separately defined regions of precious metals onto a metal substrate is disclosed. According to the disclosure, a multiplicity of plating heads are mounted for movement upon command on a rotating, endless belt or bandolier which is disposed adjacent to the path of travel of a moving strip of substrate metal, such as copper, on which the regions are to be plated. Sensing devices are mounted adjacent to the path of travel of the metal strip to detect and indicate the regions on the strip which are to be plated. The sensing of a region to be plated connects the next available plating head to the belt or bandolier for movement along a path in which the plating head is in contact with the region to be plated and moves at the same speed as the strip to effect electrolytic deposit of metal ions on the strip. Sufficient plating heads are provided so that a separate plating head is avaiable for activation to effect plating one each region requried to be plated. Control devices are provided to separately supply plating solution to each activated plating head and to complete the D.C. circuit which extends through an anode in the activated plating head, through the plating solution and the metal strip being plated. Once plating is accomplished, the particular plating head is deactivated and returned to a reserve position on the belt or bandolier for use as required.

REFERENCES:
patent: 4414075 (1983-11-01), Cockeram
patent: 4431500 (1984-02-01), Messing et al.
patent: 4452684 (1984-06-01), Palnik
patent: 4610772 (1986-09-01), Palnik
patent: 4818349 (1989-04-01), Smith

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