Continuous copper electroplating method

Details Continuous copper electroplating method Continuous copper electroplating method

2011-08-02

2011-08-02

Wilkins, III, Harry D (Department: 1723)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating process fluid by means other than agitation or...

C204S232000

Reexamination Certificate

active

07988842

ABSTRACT:
A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in an overflow vessel under which the plating bath in the overflow vessel is returned to the plating vessel, providing an oxidative decomposition vessel, and returning a plating bath from the oxidative decomposition vessel through the overflow vessel to the plating vessel to circulate the plating bath between the plating vessel and oxidative decomposition vessel, and metallic copper is immersed in the plating bath in the oxidative decomposition vessel and exposed to air bubbling, so that decomposed/degenerated organic products formed by decomposition or degeneration produced during the copper electroplating can be oxidatively decomposed.

REFERENCES:
patent: 5143593 (1992-09-01), Ueno et al.
patent: 6350362 (2002-02-01), Geisler et al.
patent: 6835294 (2004-12-01), Tsuchida et al.
patent: 6899803 (2005-05-01), Matejat et al.
patent: 2002/0153254 (2002-10-01), Belongia et al.
patent: 2004/0069647 (2004-04-01), Mizohata et al.
patent: 2009/0026083 (2009-01-01), Tachibana et al.
patent: 62280374 (1987-12-01), None
patent: 3-97887 (1991-04-01), None
patent: 2003-55800 (2003-02-01), None
patent: 2003-166100 (2003-06-01), None
patent: 2004-143478 (2004-05-01), None
patent: 2005-187869 (2005-07-01), None
Machine Translation of JP 2005-187869.
English Abstract of JP 62-280374.

Affiliated with

Also associated with

Rating

Continuous copper electroplating method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Continuous copper electroplating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Continuous copper electroplating method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2725511