Continuous contour polishing of a multi-material surface

Details Continuous contour polishing of a multi-material surface Continuous contour polishing of a multi-material surface

2007-04-03

2007-04-03

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

Reexamination Certificate

active

10869605

ABSTRACT:
A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad.

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