Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate
2005-09-13
2005-09-13
Zarneke, David (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including contaminant removal or mitigation
C438S120000, C438S129000, C438S597000, C438S734000, C438S906000
Reexamination Certificate
active
06943062
ABSTRACT:
The invention describes how contaminant particles may be removed from a surface without in any way damaging that surface. First, the positional co-ordinates of all particles on the surface are recorded. Optionally, only particles that can be expected to cause current or future damage to the surface are included. Then, using optical tweezers, each particle is individually removed and then disposed of. Six different ways to remove and dispose of particles are described.
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Chen Hong-Miao
Jong Yu-Chang
Tseng Huan-Chi
Anya Igwe U.
Taiwan Semiconductor Manufacturing Co. Ltd.
Zarneke David
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