Container package for semiconductor element

Details Container package for semiconductor element Container package for semiconductor element

1990-08-27

1992-08-18

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 5059, 174 5061, 357 74, 357 70, 420 8, 420 34, 501 55, 501 60, H01L 2302

Patent

active

051401096

ABSTRACT:
Disclosed is a container package for a semiconductor element, which comprises a vessel having in the interior thereof a space for containing a semiconductor element, which comprises an insulating substrate and a lid member, an external lead terminal for connecting the semiconductor element contained in the vessel to an electric circuit and a sealing agent for sealing the vessel and external lead terminal, wherein the external lead terminal is composed of an electroconductive material having a permeability lower than 210 (CGS) and a thermal expansion coefficient of from 9.times.10.sup.-6 to 12.times.10.sup.-6 /.degree.C.

REFERENCES:
patent: 4103416 (1978-08-01), Sakamoto
patent: 4262165 (1981-04-01), Ohwaki et al.
patent: 4482781 (1984-11-01), Burns
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 4882212 (1989-11-01), SinghDeo et al.
patent: 4931854 (1990-06-01), Yonemasu et al.
patent: 4966926 (1990-10-01), Donohue

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