Container package for semiconductor element

Details Container package for semiconductor element Container package for semiconductor element

1990-08-24

1991-10-15

James, Andrew J.

357 70, 357 67, H01L 2354, H01L 2310

Patent

active

050579053

ABSTRACT:
Disclosed is a container package for a semiconductor element, which comprises an insulating vessel having in the interior thereof a space for containing a semiconductor element, which comprises an insulating substrate and a lid member, an external lead terminal for connecting the semiconductor element contained in the vessel to an electric circuit and a sealing agent for sealing the vessel and external lead terminal, wherein the external lead terminal is composed of an electroconductive material having a permeability lower than 210 (CGS), a thermal expansion coefficient of from 5.times.10.sup.-6 to 12.times.10.sup.-6 /.degree.C. and an electroconductivity of at least 10% (International Annealed Copper Standard).

REFERENCES:
patent: 4521801 (1985-06-01), Kato et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4729010 (1988-03-01), Tsuchiya et al.
patent: 4805009 (1989-02-01), Pryor et al.
patent: 4958216 (1990-09-01), Tanaka et al.

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