Container package for semiconductor element

Details Container package for semiconductor element Container package for semiconductor element

1990-08-27

1992-12-01

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357678, H01L 2302

Patent

active

051681269

ABSTRACT:
Disclosed is a container package for a semiconductor element, which comprises a vessel having in the interior thereof a space for containing a semiconductor element, which comprises an insulating substrate and a lid member, an external lead terminal for connecting the semiconductor element contained in the vessel to an electric circuit and a sealing agent for sealing the vessel and external lead terminal, wherein the external lead terminal is composed of an electroconductive material having a thermal expansion coefficient of from 5.times.10.sup.-6 to 12.times.10.sup.-6 /.degree.C. and an electroconductivity of at least 10% (International Annealed Copper Standard).

REFERENCES:
patent: 4262165 (1981-04-01), Ohwaki et al.
patent: 4752334 (1988-06-01), Nadkarni et al.
patent: 4821151 (1989-04-01), Prior et al.
patent: 5015803 (1991-05-01), Mahulikar et al.

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