Design Patent
2001-12-19
2003-09-09
Hyder, Philip S. (Department: 2912)
Design Patent
active
D0479399
CLAIM:
The ornamental design for a container for transporting substrates, as shown and described.
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“Shin-Etsu 300mm FOUP (Front Opening Unified Pod)”, whole pages, Shin-Etsu Polymer Co., Ltd.
“F300 AutoPod™ Wafer Carrier 300mm”, whole pages, Fluoroware, Inc.
ASYST SMIF-POD 300, whole pages, Asyst Technologies Inc.
U.S. Provisional application Ser. No. 60/340,503, filed Dec. 19, 2001 (Akira Tanaka et al.).
Kishi Takashi
Suzuki Yoko
Tanaka Akira
Ebara Corporation
Hyder Philip S.
Wenderoth , Lind & Ponack, L.L.P.
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