Container for packaging semiconductor components

Special receptacle or package – For a building component – Shingle

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Details

206334, 206 4534, 206521, 220 82R, 361220, B65D 8542, B65D 6518, H05F 302

Patent

active

043278329

ABSTRACT:
A container for packaging semiconductor components is formed by a tube adapted to longitudinally contain a stack of components and having a body portion made of electrically conductive opaque plastic and a window portion made of electrically non-conductive transparent plastic. In this way EMI shielding is provided and visual inspection of the components is possible.

REFERENCES:
patent: 2919797 (1960-01-01), McCracken
patent: 3184056 (1965-05-01), Kisor
patent: 3205764 (1965-09-01), Letter
patent: 3432380 (1969-03-01), Weber
patent: 4171049 (1979-10-01), Nohara et al.

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