Contacts for chip carrier socket

Geometrical instruments

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Details

339 17CF, 339217S, 339252R, H01R 900

Patent

active

044602375

ABSTRACT:
Contact designs for leadless chip carrier sockets of either the surface compression or the solder type. The contact for a compression type socket employs a dual cantilever configuration mounted on a base member which mechanically isolates one portion of the contact from another. Two cooperative contact designs are used for a solder type socket in which each type is alternately arranged with respect to the other in mounted relationship on a base member. The upper chip carrier contacting portions of the two contacts for a solder type socket are disposed side-by-side along each side wall, while the terminal ends are aligned inwardly perpendicular to the upper alignment.

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