Geometrical instruments
Patent
1981-12-30
1984-07-17
McQuade, John
Geometrical instruments
339 17CF, 339217S, 339252R, H01R 900
Patent
active
044602375
ABSTRACT:
Contact designs for leadless chip carrier sockets of either the surface compression or the solder type. The contact for a compression type socket employs a dual cantilever configuration mounted on a base member which mechanically isolates one portion of the contact from another. Two cooperative contact designs are used for a solder type socket in which each type is alternately arranged with respect to the other in mounted relationship on a base member. The upper chip carrier contacting portions of the two contacts for a solder type socket are disposed side-by-side along each side wall, while the terminal ends are aligned inwardly perpendicular to the upper alignment.
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Brown Vincent B.
Schlacks Robert F.
McQuade John
Methode Electronics Inc.
Paumen Gary K.
Pigott, Jr. Charles F.
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