Contactor floor that holds an IC package to contactor pins...

Details Contactor floor that holds an IC package to contactor pins... Contactor floor that holds an IC package to contactor pins...

1999-09-07

2001-05-08

Metjahic, Safet (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S761010, C439S070000

Reexamination Certificate

active

06229330

ABSTRACT:

TECHNICAL FIELD
The present invention relates generally to IC (Integrated Circuit) package testing systems, and more particularly, to design of a contactor floor and contactor pins for coupling an IC package to an IC package testing system with minimized solder flaking.
BACKGROUND OF THE INVENTION
Referring to
FIG. 1A
, a typical IC (Integrated Circuit) package
102
includes a plurality of leads for coupling nodes of an IC die within the IC package
102
to a system external to the IC package
102
.
FIG. 1A
shows a bottom view of the IC package
102
. A first side
104
of the IC package
102
includes a first lead
106
, a second lead
108
, and a third lead
110
. A second side
112
of the IC package
102
includes a fourth lead
114
, a fifth lead
116
, and a sixth lead
118
. A third side
120
of the IC package
102
includes a seventh lead
122
, an eighth lead
124
, and a ninth lead
126
. A fourth side
128
of the IC package
102
includes a tenth lead
130
, an eleventh lead
132
, and a twelfth lead
134
. A typical IC package includes more numerous leads to a side of the IC package. However, three leads to a side of the IC package
102
are shown in
FIG. 1A
for clarity of illustration.
Referring to
FIG. 1B
, a side view of the first side
104
of the IC package
102
of
FIG. 1A
is shown. The side view of the first side
104
of the IC package
102
in
FIG. 1B
also shows a side view of the fourth lead
114
on the second side
112
of the IC package
102
and a side view of the twelfth lead
134
on the fourth side
128
of the IC package
102
.
An IC package is tested for proper functionality by applying test signals to some of the plurality of leads of the IC package and by measuring resulting signals at some of the plurality of leads of the IC package. Thus, the plurality of leads of the IC package are coupled to a system for testing the IC package.
Referring to
FIG. 2
, the IC package
102
is mounted within an insert of a contactor floor
202
of such a system for testing an IC package. The IC package
102
is mounted on the contactor floor
202
with the plurality of leads facing up and away from the contactor floor
202
. The contactor floor
202
holds the IC package
102
for moving the IC package
102
within the system for testing the IC package
102
. A respective contactor pin of the system for testing the IC package is coupled to each of the plurality of leads
106
,
108
,
110
,
114
,
116
,
118
,
122
,
124
,
126
,
130
,
132
, and
134
for coupling a corresponding lead to the system for testing the IC package. However, in
FIG. 2
, only a first contactor pin
204
for coupling the twelfth lead
134
of the IC package
102
and a second contactor pin
206
for coupling the fourth lead
114
of the IC package
102
to the system for testing the IC package
102
are shown for clarity of illustration.
The first contactor pin
204
is placed within a first contactor pin socket
208
that properly aligns the first contactor pin
204
to a desired position within the system for testing the IC package
102
. The second contactor pin
206
is placed within a second contactor pin socket
210
that properly aligns the second contactor pin
206
to a desired position within the system for testing the IC package
102
.
When the IC package
102
is in a testing position, a contacting protrusion
212
of the first contactor pin
204
makes contact with the twelfth lead
134
of the IC package
102
for coupling the twelfth lead
134
to the system for testing the IC package
102
. Also, when the IC package
102
is in the testing position, a positioning protrusion
214
of the first contactor pin
204
may rest on an upper angled surface
216
of the contactor floor
202
. The positioning protrusion
214
may further affect the position of the contacting protrusion
212
of the first contactor pin
204
.
Similarly, when the IC package
102
is in the testing position, a contacting protrusion
218
of the second contactor pin
206
makes contact with the fourth lead
114
of the IC package
102
for coupling the fourth lead
114
to the system for testing the IC package
102
. A positioning protrusion
220
of the second contactor pin
206
may rest on an upper angled surface
222
of the contactor floor
202
. The positioning protrusion
220
may further affect the position of the contacting protrusion
218
of the second contactor pin
206
.
The contactor floor
202
holds and moves the IC package
102
to and away from the testing position. In the testing position, a respective contactor pin makes contact with a corresponding one of each of the plurality of leads
106
,
108
,
110
,
114
,
116
,
118
,
122
,
124
,
126
,
130
,
132
, and
134
for coupling that corresponding lead to the system for testing the IC package. In the testing position, the contactor floor moves the IC package
102
downward until the respective contactor pin makes contact with the corresponding lead of the IC package
102
. Referring to
FIG. 3
, when the IC package
102
is not in the testing position, the contactor floor
102
moves the IC package
102
upward and away from the contactor pins. Elements having the same reference number in
FIGS. 2 and 3
refer to elements having similar structure and function.
A compression spring
224
is disposed below the contactor floor
202
within an opening at the bottom of the contactor floor
202
. Referring to
FIG. 2
, when the IC package
102
is moved to the testing position, the compression spring
224
is compressed as the contactor floor
202
is moved down with the IC package
202
toward the contactor pins. Referring to
FIG. 3
, when the IC package
102
is not in the testing position, the compression spring
224
is decompressed as the contactor floor
202
is moved upward with the IC package
102
away from the contactor pins.
Referring to
FIG. 4
, a top view of the contactor floor
202
of the prior art includes bilevel surfaces on each of the side wall of the contactor floor
202
. A first indentation
402
is present on a first side wall
404
of the contactor floor
202
of the prior art, a second indentation
406
is present on a second side wall
408
of the contactor floor
202
of the prior art, a third indentation
410
is present on a third side wall
412
of the contactor floor
202
of the prior art, a fourth indention
414
is present on a fourth side wall
416
of the contactor floor
202
of the prior art.
Referring to
FIGS. 3 and 4
, a contactor pin fits within the indentation of a side wall of the contactor floor and slides along that side wall within that indentation as the contactor floor
202
of the prior art moves toward and away from the testing position with respect to the contactor pin. The indentation on a side wall of the contactor floor of the prior art ensures that the contactor pin is positioned sufficiently in toward the leads of the IC package
102
such that the contacting protrusion of the contactor pin makes contact with the corresponding lead of the IC package
102
when the IC package
102
is in the testing position with respect to the contactor pins.
However, as the contactor floor
202
of the prior art moves up and down for moving the IC package
102
toward and away from the testing position, the contacting protrusion of the contactor pin slides and scrapes along the corresponding lead. Referring to
FIG. 5
, the contactor floor
202
is moving the IC package
102
up with respect to the contactor pins toward the testing position. During such movement, the contacting protrusion
212
of the first contactor pin
204
scrapes along the twelfth lead
134
of the IC package
102
, and the contacting protrusion
218
of the second contactor pin
206
scrapes along the fourth lead
114
of the IC package
102
.
Referring to
FIG. 6
, the contactor floor
202
is moving the IC package
102
down with respect to the contactor pins away from the testing position after the IC package
102
has been tested. During such movement also, the contacting protrusion
212
of th

Affiliated with

Also associated with

Rating

Contactor floor that holds an IC package to contactor pins... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Contactor floor that holds an IC package to contactor pins..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contactor floor that holds an IC package to contactor pins... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2563809