Contactor and semiconductor device inspecting method

Details Contactor and semiconductor device inspecting method Contactor and semiconductor device inspecting method

1997-11-03

2000-03-21

Ballato, Josie

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324755, G01R 102

Patent

active

060407069

ABSTRACT:
Semiconductor chips 15 are separated from one another by cutting a semiconductor wafer along scribing lines, and are fitted in recesses 11 formed in a contactor 10. Bump electrodes 13 are brought into contact with the pad electrodes of the semiconductor chips, so that the former electrodes are electrically connected to the latter electrodes. Each of the recesses of the contactors are surround by side walls which are trapezoid in section. Hence, the side walls can be readily fitted in the grooves formed along the scribing lines; that is, the semiconductors 15 can be fitted in the recesses 11 with ease. The contactor 10 and the dicing sheet having the semiconductor chips 15 are pressed against each other, so that the electrode connection is positively achieved.

REFERENCES:
patent: 4766371 (1988-08-01), Moriya
patent: 5559444 (1996-09-01), Farnworth et al.
patent: 5865632 (1999-02-01), Iwasaki
"Nitto Technical Report", vol. 28, No. 2, Oct. 1990, pp. 57-62.

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