Contacting system for bipolar electronic circuit elements, more

Details Contacting system for bipolar electronic circuit elements, more Contacting system for bipolar electronic circuit elements, more

1985-01-23

1989-08-29

Sikes, William L.

357 26, 357 61, 357 68, 357 74, H01L 2342, H01L 2302

Patent

active

048622486

ABSTRACT:
In a contacting system for bipolar electronic circuit elements, more particularly semiconductor circuit elements, in which a circuit element body provided on at least one of two major surfaces located opposite each other with a thick, pressure-contact layer is held under pressure between two contact bodies interconnected by a housing, more particularly a soft glass housing. The risk of contact interruptions with frequent temperature variations in a range of from 0.degree. to 300.degree. C. is eliminated in that the thick pressure contact layers are subdivided into several contact blocks, preferably three or four, which are mutually separated and arranged beside each other.
The surface of the contact blocks facing the contact bodies may be coated with a connection layer, which serves to establish during sealing into a soft glass envelope a connection by soldering or diffusion welding between the contact blocks and the contact bodies.

REFERENCES:
patent: 3551757 (1970-12-01), Kristensen et al.
patent: 4402004 (1983-06-01), Iwasaki

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