Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-11-07
1996-12-24
Bradley, P. Austin
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439630, H01R 909
Patent
active
055868908
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
1. Technical Field of the Invention
The invention relates to a contacting apparatus for a chipcard. The invention relates specifically to a contacting apparatus for a SIM-card. As it is well known, SIM-cards are a special kind of chipcards which are smaller than the conventional chipcards. For instance, the SIM-cards contain information about the subscriber of a telephone company. It is for that reason that such cards are called SIM-cards with the prefix "SIM" having the meaning of "subscriber identity module".
2. Description of the Prior Art
Regarding contacting apparatus attention is drawn to German published patent applications DE 41 18 312 A1, DE 40 08 655 A1 and DE 40 30 196 A1.
The known contacting apparatus, specifically the contacting apparatus for SIM-cards have larger dimensions than the SIM-card itself primarly due to the fact that card guide means are provided. Customarily, the SIM-card has a size of 25 mm.times.15 mm. Thus, the guide means require space which might be necessary for other purposes. This is particularly true in a situation where the contacting apparatus has to be placed on a circuit board. In such a situation space, which otherwise could be used by other components is wasted. Such a situation might specifically cause a problem in the area of the so-called surface mounted technology (SMT). Another problem is the heating-up of the contacting apparatus; this is a particular problem due to the fact that the contact elements of the contacting apparatus need to find support in the contact support.
Another disadvantage of the contact apparatus of the prior art is that it is generally necessary to use a mechanical lowering means so as to achieve high cycle numbers for plugging (the card into the contacting apparatus, and for removing it). If no mechanical lowering means is used, then after a few thousend cycles the noble metal layers galvanized onto the slide contacts will be worn down to the base material.
SUMMARY OF THE INVENTION
It is an object of the present invention to overcome the disadvantages of the prior art. The present invention specifically intends to provide a contacting apparatus which has extremely small outer dimensions and can be preferably used together with other SMT-components. Further, also though a smaller and thinner design is used, even under conditions of heat a stable design should be obtained.
It is another object of the invention to provide a contacting apparatus which achieves a high number of plugging cycles together with good operating characteristics.
In accordance with a first aspect of the present invention, the contacting apparatus comprises a contact support having small outer dimensions. Said contact support can preferably be designed as a purely SMT-component providing specifically only the function of making contact but not providing the function of guiding the SIM-card. Preferably, the means for guiding the SIM-card are spaced with respect to the contact support and are arranged at a different component of the contacting apparatus, for instance at a housing of the contacting apparatus.
Due to the fact that the means necessary for guiding the card are not provided at the bottom of the contact support but, for instance, on the top of the housing, the circuit board can be equipped with SMT components below the guide means for the chipcard.
It should be noted in this context that it is also considered to be feasible to arrange the guide means not at the bottom of the contact support but on top of the contact support such that there is space provided below the guide means for certain SMT-components to be placed on the circuit board on which the contact support is mounted.
In a accordance with a second aspect of the present invention, a contacting apparatus for a chipcard is provided which does not require a mechanical lowering means but achieves a high number of plug cycles by providing the following: a noble metal layer is provided on the contact cusps of the contact elements of the contacting apparatus, said noble met
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patent: 4976640 (1990-12-01), Schuder et al.
patent: 5012078 (1991-04-01), Pernet
patent: 5152694 (1992-10-01), Bargain
patent: 5259777 (1993-11-01), Schuder et al.
patent: 5269707 (1993-12-01), Reichardt et al.
patent: 5320552 (1994-06-01), Reichardt et al.
patent: 5427535 (1995-06-01), Sinclair
Amphenol-Tuchel Electronics GmbH
Bradley P. Austin
Demello Jill
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