Contact temperature probe with thermal isolation

Details Contact temperature probe with thermal isolation Contact temperature probe with thermal isolation

2000-02-01

2001-12-25

Gutierrez, Diego (Department: 2859)

Thermal measuring and testing

Temperature measurement

By electrical or magnetic heat sensor

C374S165000, C374S208000, C136S221000, C136S233000

Reexamination Certificate

active

06332709

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention is directed to an improved contact temperature probe for measuring the temperature of a semiconductor wafer being processed, and particularly to a temperature probe which provides more accurate temperature readings.
In U.S. Pat. No. 5,791,782, a contact temperature probe is disclosed having a probe head which pivots under the weight of a semiconductor wafer, so as to maintain close contact therewith. In
FIG. 12
of such patent, an embodiment is disclosed wherein the probe head is set on and pivots on the lip of a quartz shield through which the temperature sensor lead wires are run to protect the wires from the process environment.
While the concept of a pivoting probe head results in reduced contact resistance between the wafer and the probe head, it has been found that for some applications the temperature measurements which are afforded by the prior art probe are not as accurate as is desired.
SUMMARY OF THE INVENTION
It is thus one object of the invention to provide a contact temperature probe which provides more accurate measurements.
In accordance with the invention, the above as well as other objects are obtained by providing a contact temperature probe having a probe head having a flat contact surface for contacting the semiconductor wafer and including a temperature sensor having lead wires which exit the body and run through a shield for shielding the wires from the process environment, wherein the probe head is supported only by the temperature sensor lead wires and the shield does not touch the probe head.


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