Contact technique for electrical circuitry

Details Contact technique for electrical circuitry Contact technique for electrical circuitry

1980-03-07

1982-02-16

Edlow, Martin H.

357 4, 357 65, 357 71, H01L 3922

Patent

active

043162002

ABSTRACT:
In electrical circuitry, and particularly superconducting circuitry including Josephson tunnelling devices, it is often necessary to provide solder contacts to electrical lines, where the electical lines would be destroyed if there were interdiffusion between the lines and the solder. To avoid this problem, a laterally extending metallic layer is used as a diffusion barrier between the solder land and the electrical line which can be a superconducting line. The diffusion barrier is comprised of a refractory metal which has a first portion electrically contacting the solder land and a second, laterally displaced portion, electrically contacting the electrical line. An insulating protective layer on the diffusion barrier layer separates the solder land and the electrical line. In a specific embodiment, the superconducting electrical line is comprised of an alloy of lead while the diffusion barrier is comprised of niobium, and the solder alloy is a low melting point alloy, typically comprised of indium, bismuth, and tin.

REFERENCES:
patent: 3645785 (1972-02-01), Hentzschel
patent: 3663184 (1972-05-01), Wood
patent: 3939047 (1976-02-01), Tsunemitsu
patent: 4107726 (1978-08-01), Schilling
patent: 4177476 (1979-12-01), Kroger
Berry et al., IBM Journ. Res. Develop., vol. 13, No. 3, May 1969, p. 286.
Howard et al., IBM Tech. Discl. Bull., vol. 20, No. 9, Feb. 1976, p. 3477ff.

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