Contact system for semiconductor arrangement

Details Contact system for semiconductor arrangement Contact system for semiconductor arrangement

1975-02-10

1977-01-25

Miller, Jr., Stanley D.

357 68, 357 69, H01L 2348, H01L 2946

Patent

active

040054560

ABSTRACT:
A semiconductor arrangement comprises a semiconductor body with a metal layer thereon whose exterior surface is vapor deposited or sputtered gold, a layer of palladium on the metal layer and a connecting region of electrolytically deposited gold on the palladium layer.

REFERENCES:
patent: 3290127 (1966-12-01), Kahng et al.
patent: 3495959 (1970-02-01), Johnson, Jr.
patent: 3609472 (1971-09-01), Bailey
patent: 3645785 (1972-02-01), Hentzschel
patent: 3662454 (1972-05-01), Miller
patent: 3775200 (1973-11-01), DE Nobel et al.
patent: 3878554 (1975-04-01), Mikome

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