Contact structure having a compliant bump and a testing area

Details Contact structure having a compliant bump and a testing area Contact structure having a compliant bump and a testing area

2011-07-12

2011-07-12

Pizarro, Marcos D. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S741000, C257SE23021

Reexamination Certificate

active

07977788

ABSTRACT:
A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.

REFERENCES:
patent: 4749120 (1988-06-01), Hatada et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5508228 (1996-04-01), Nolan et al.
patent: 5707902 (1998-01-01), Chang et al.
patent: 5877556 (1999-03-01), Jeng et al.
patent: 324847 (1998-01-01), None

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