Contact structure for connecting an electrode to a semiconductor

Details Contact structure for connecting an electrode to a semiconductor Contact structure for connecting an electrode to a semiconductor

1994-09-30

1996-04-30

Quach, T. N.

Fishing, trapping, and vermin destroying

437190, 437192, 748DIG19, H01L 21283

Patent

active

055125166

ABSTRACT:
A contact structure for connecting a semiconductor device to a wiring electrode includes a semiconductor layer forming a part of the semiconductor device. A first contact layer of reduced resistivity covers a surface of the semiconductor layer. An insulating structure is provided on the first contact layer so as to bury the first contact layer underneath. A penetrating hole is opened through the insulating structure so as to expose a part of the first contact layer. A second contact layer of reduced resistivity is provided on the part of the first contact layer exposed by the penetrating hole. The second contact layer extends from a bottom of the penetrating hole along its side wall. A conductor layer forms the wiring electrode on the second contact layer.

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