Contact structure for a semiconductor substrate on a mounting bo

Details Contact structure for a semiconductor substrate on a mounting bo Contact structure for a semiconductor substrate on a mounting bo

1982-06-18

1984-10-30

Edlow, Martin H.

357 67, 357 65, H01L 2354, H01L 2318

Patent

active

044802617

ABSTRACT:
In bonding a semiconductor substrate onto a mounting means, a multiple layer metal electrode is formed on the surface, the multiple layer comprising at least a chromium-nickel alloy layer, nickel layer and a noble metal layer of a noble metal selected from a group consisting of gold, silver or platinum, which is bonded to a solder layer of Pb-Sn-alloy or Ag-Sb-Sn-alloy of the mounting means.

REFERENCES:
patent: 2801375 (1957-07-01), Losco
patent: 3266127 (1966-08-01), Harding et al.
patent: 3381256 (1968-04-01), Schuller et al.
patent: 3386894 (1968-06-01), Steppat
patent: 3562040 (1971-02-01), Garies
patent: 3922385 (1975-11-01), Konantz et al.
patent: 4176443 (1979-12-01), Iannuzzi et al.

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