Contact spring assembly for electronic devices

Details Contact spring assembly for electronic devices Contact spring assembly for electronic devices

2007-12-27

2009-08-25

Patel, T C (Department: 2839)

Electrical connectors

Metallic connector or contact having movable or resilient...

Spring actuated or resilient securing part

C200S292000

Reexamination Certificate

active

07578712

ABSTRACT:
A contact spring assembly (30) for an electronic device includes a mounting portion (31), a press spring (32), and a deformable spring (37). The press spring and the deformable spring are respectively bent from the mounting portion. The press spring resists the deformable spring. The press spring is configured to be moved along a first direction and push the deformable spring to move along a second direction different from the first direction.

REFERENCES:
patent: 287320 (1883-10-01), Perkins
patent: 2731609 (1956-01-01), Sobel, III
patent: 2825037 (1958-02-01), French
patent: 3243562 (1966-03-01), O'Brien
patent: 3350530 (1967-10-01), Fry
patent: 3356817 (1967-12-01), Matthews
patent: 3493706 (1970-02-01), Anderson et al.
patent: 3617980 (1971-11-01), Alkire et al.
patent: 3809838 (1974-05-01), Coppola
patent: 3917917 (1975-11-01), Murata
patent: 4136269 (1979-01-01), Weidler
patent: 4307268 (1981-12-01), Harper
patent: 4350855 (1982-09-01), Bobb et al.
patent: 4752254 (1988-06-01), Inoue et al.
patent: 4789764 (1988-12-01), Doros
patent: 5924557 (1999-07-01), Pollock
patent: 6132220 (2000-10-01), McHugh et al.
patent: 6227870 (2001-05-01), Tanaka
patent: 6365848 (2002-04-01), Maple
patent: 6398559 (2002-06-01), Tanaka
patent: 6500012 (2002-12-01), Billenstein et al.
patent: 6561819 (2003-05-01), Huang et al.
patent: 2004/0121629 (2004-06-01), You
patent: 2004/0132319 (2004-07-01), Richter et al.
patent: 2005/0009380 (2005-01-01), Brown et al.
patent: 2007/0059976 (2007-03-01), Yeh et al.

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