Contact sensor package

Details Contact sensor package Contact sensor package

2007-03-20

2007-03-20

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

C257S691000

Reexamination Certificate

active

11044027

ABSTRACT:
A contact sensor chip package includes a substrate, a contact sensor chip, a ground member and an encapsulation. The contact sensor chip is disposed on the substrate, and the contact sensor chip has a sensor area. The ground member is disposed on the ground pad of the substrate, and the ground member is electrically connected to the ground pad. The encapsulation covers the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.

REFERENCES:
patent: 6028773 (2000-02-01), Hundt
patent: 6804121 (2004-10-01), Fischbach et al.

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