Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2011-03-15
2011-03-15
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S780000, C228S180500
Reexamination Certificate
active
07906858
ABSTRACT:
A method for establishing an electrical connection between a first contact surface and a second contact surface, with a wire-bonding tool being used to provide a contact wire between the contact surfaces by bonding the contact wire to the first contact surface and subsequently leading it to the second contact surface, bonding it to the latter, and subsequently, separating it using the wire-bonding tool. After the contact wire has been separated from the second contact surface, the wire-bonding tool is used to provide the contact point with an additional contact securing element via the contact wire.
REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3623649 (1971-11-01), Keisling
patent: 4415115 (1983-11-01), James
patent: 5111989 (1992-05-01), Holdgrafer et al.
patent: 5172851 (1992-12-01), Matsushita et al.
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5421503 (1995-06-01), Perlberg et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5836071 (1998-11-01), Falcone et al.
patent: 5852871 (1998-12-01), Khandros
patent: 5960262 (1999-09-01), Torres et al.
patent: 6079610 (2000-06-01), Maeda et al.
patent: 6158647 (2000-12-01), Chapman et al.
patent: 6270000 (2001-08-01), Nishiura
patent: 6295729 (2001-10-01), Beaman et al.
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6715666 (2004-04-01), Imai et al.
patent: 57 012 530 (1982-01-01), None
patent: 59 195 836 (1984-11-01), None
patent: 61 280 626 (1986-12-01), None
patent: 63 244 633 (1988-10-01), None
patent: 63244633 (1988-10-01), None
patent: 01 057 725 (1989-03-01), None
patent: 01 158 742 (1989-06-01), None
patent: 01 239 861 (1989-09-01), None
patent: 01 276 729 (1989-11-01), None
patent: 03 289 149 (1991-12-01), None
patent: 08008284 (1996-01-01), None
Kenyon & Kenyon LLP
Mandala Victor A
Robert & Bosch GmbH
Stowe Scott
LandOfFree
Contact securing element for bonding a contact wire and for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Contact securing element for bonding a contact wire and for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Contact securing element for bonding a contact wire and for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2746868