Contact ring design for reducing bubble and electrolyte...

Details Contact ring design for reducing bubble and electrolyte... Contact ring design for reducing bubble and electrolyte...

2007-04-17

2007-04-17

Bell, Bruce F. (Department: 1746)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S287000, C204S297010, C204S297060, C204S297080, C204S279000

Reexamination Certificate

active

10973851

ABSTRACT:
A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.

REFERENCES:
patent: 5437777 (1995-08-01), Kishi
patent: 6398926 (2002-06-01), Mahneke

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