Semiconductor device manufacturing: process – Forming schottky junction – Combined with formation of ohmic contact to semiconductor...
Reexamination Certificate
2005-04-19
2005-04-19
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Forming schottky junction
Combined with formation of ohmic contact to semiconductor...
C438S384000
Reexamination Certificate
active
06881655
ABSTRACT:
A method is provided of forming a low resistance contact between a poly-silicon resistor of an integrated circuit and a conducting material, the method comprising the steps of:a) covering the resistor with an insulating layer;b) etching at least one contact opening in the insulating layer;c) cleaning the insulating layer to remove any residues from the etching process;d) applying phosphoric acid; ande) depositing a conducting layer which forms an electrical contact with said resistor.
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Dang Phuc T.
Moser, Patterson & Sheridan L.L.P.
Zarlink Semiconductor Limited
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