Contact probe, measuring pad used for the contact probe, and...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S754090

Reexamination Certificate

active

11136572

ABSTRACT:
There is provided a contact probe that is smaller than 50 μm in a pitch between a signal electrode and a ground electrode and can correctly conduct a high-speed high-frequency measurement, a measuring pad used for the contact probe, and a method of manufacturing the contact probe. The contact probe includes: a tip member having a signal electrode10aand a ground electrode11athat are put into contact with an object to be measured; and a coaxial cable1having a core1belectrically connected to the signal electrode10aand an outer covering conductor1aelectrically connected to the ground electrode1a, wherein the tip member is formed on a printed wiring board2, and wherein the signal electrode10aand the ground electrode11aare constructed of fine coplanar strip lines formed on an insulating board2a.

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patent: 2005/0236717 (2005-10-01), Aoyagi et al.
Katsuya Kikuchi et al., “Fabrication of High-Density Wiring Interposer for . . . ” Japanese Journal of Applied Physics, vol. 43, No. 7A, pp. 4141-4145, 2004.
Katsuya Kikuchi et al., “Fabrication of High-Density Wiring Interposer for . . . ” Extended Abstracts of the 2003 International Conference on Solid State Devices and Materials, pp. 382-383.

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