Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2008-04-15
2008-04-15
Vu, David (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C257S059000
Reexamination Certificate
active
07358104
ABSTRACT:
A method for manufacturing a semiconductor device including forming a first wire on a substrate, forming a lower film on the first wire, forming a photosensitive pattern on the lower film using a photosensitive material, forming contact holes for exposing the first wire by etching the lower film using the photosensitive film as an etching mas, removing part of the photosensitive film pattern by an ashing process to expose a borderline of the lower film defining the contact holes and forming second wire connected to the firs wire via the contact holes.
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Hong Mun-Pyo
Hong Wan-Shick
Jung Kwan-Wook
Kim Bo Sung
Kim Sang-Gab
Cantor & Colburn LLP
Samsung Electornics Co., Ltd.
Vu David
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