Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-05-23
1996-05-21
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
324761, 439 73, 439700, H01R 2372
Patent
active
055184103
ABSTRACT:
A contact pin device for IC sockets includes a socket body having a plurality of contact pins; a floating plate which is sustained above socket body, always urged upward, and has contact receivers formed therein for receiving the contact pins; and a pressing member which is mounted on the floating plate and is used to press down a BGA type IC package having a plurality of downward protruding spherical connecting terminals. The floating plate allows the spherical connecting terminals of the IC package to be brought into contact with the contact pins in the contact receivers thereof. Further, the top ends of the contact pins are provided with contact sections for receiving and electrically connecting lower spherical sections other than spherical tips of the spherical connecting terminals. The contact pin device for IC sockets has a relatively simple configuration, but assures secure electrical connection between the connecting terminals and the contact members. Additionally, the rotations of the contact sections in a condition where the contact sections are urged against and brought into contact with the spherical connecting terminals prevent an electrical connection failure attributable to dust and oxides. This provision is also applicable to IC sockets for IC package of gull-wing, LGA, and LCC types.
REFERENCES:
patent: 4061969 (1977-12-01), Dean
patent: 5032787 (1991-07-01), Johnston et al.
patent: 5106309 (1992-04-01), Matsuoka et al.
patent: 5419710 (1995-05-01), Pfaff
Abrams Neil
Enplas Corporation
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