Contact pads for radiation imagers

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation

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Details

257292, 257457, H01L 31062, H01L 31113, H01L 3100

Patent

active

058380540

ABSTRACT:
Contact pads for providing external electrical connection to components on a radiation imager having a photosensor array include a body of the material utilized for fabrication of the photosensors with an indium tin oxide (ITO) top layer disposed over the photosensor material to provide a contact region. A metal contact surface can also be disposed over the ITO. A barrier dielectric material is further disposed over portions of the contact pad.

REFERENCES:
patent: 4725890 (1988-02-01), Yaniv et al.
patent: 4739414 (1988-04-01), Pryor et al.
patent: 4889983 (1989-12-01), Numano et al.
patent: 5202575 (1993-04-01), Sakai
patent: 5532180 (1996-07-01), den Boer et al.
patent: 5614727 (1997-03-01), Mauri et al.

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