Contact pad supporting structure and integrated circuit for...

Details Contact pad supporting structure and integrated circuit for... Contact pad supporting structure and integrated circuit for...

2009-04-28

2011-12-20

Nguyen, Ha Tran T (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S781000, C257S786000, C257S758000, C257S773000, C257S700000, C438S622000, C438S629000, C438S666000, C438S614000, C438S637000

Reexamination Certificate

active

08080881

ABSTRACT:
The invention provides a contact pad supporting structure. The contact pad supporting structure includes an underlying first conductive plate and an overlying second conductive plate, wherein the first and second conductive plates are separated by a first dielectric layer. A plurality of circular ring-shaped via plug groups comprising a plurality of circular ring-shaped via plugs is through the first dielectric layer, electrically connecting to the first and second conductive plates. All of the circular ring-shaped via plugs of each of the circular ring-shaped via plug groups are disorderly arranged.

REFERENCES:
patent: 5739587 (1998-04-01), Sato
patent: 2008/0246152 (2008-10-01), Liu et al.

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